Mr. Netzer was appointed Senior Vice President of Corporate Planning in February 2013 after serving as Vice President of Corporate Planning since November 2008. Prior to this, he served as General Manager of Mixed Signal, RF and Power Management Product Lines since 2005 and as Director, FAB 2 Yield and Device Engineering Manager since 2000. From 1995 to 2000, Mr. Netzer served in various engineering management positions within the R&D division dealing with CMOS, Mixed Signal, RF, and NVM Technologies.
Prior to joining Tower, Mr. Netzer was employed at National Semiconductor and the Technion - Israel Institute of Technology.
Mr. Netzer holds a B.Sc. degree in electrical engineering from the Technion - Israel Institute of Technology.