Fact Sheet
About
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM) and its subsidiaries operate collectively under the brand name Tower Semiconductor, the global specialty foundry leader. Tower Semiconductor manufactures advanced analog integrated circuits for a diversified and strong customer base in various growing markets.
Technology and Market Leadership
Tower Semiconductor specializes in customized analog solutions for manufacturing differentiated products, offering leading edge specialty process technologies including Radio Frequency (RF), High Performance Analog (HPA), integrated Power Management, CMOS Image Sensors (CIS), Non-Imaging Sensors & Displays, and Mixed-Signal/CMOS as well as Micro-Electro-Mechanical Systems (MEMS) capabilities.
Deeply rooted in proven technologies, the Company continues to drive innovation within silicon rather than by pure technological node shrinkage.
Tower Semiconductor enables competitiveness and high value propositions for rising markets such as connectivity, power efficiency and smart systems (sensors). It also offers Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. In addition, the Company provides a world-class design enablement platform, complementing its sophisticated technology to enable a quick and accurate design cycle.
Global Operations
Tower Semiconductor operates multiple manufacturing facilities in three geographic regions: two fabs (150mm and 200mm) located in Migdal Haemek, Israel, two fabs (200mm) in the US (Newport Beach, California and San Antonio, Texas), two additional fabs (200mm and 300mm) through Tower Partners Semiconductor Co., Ltd. (TPSCo) located in Japan, and is sharing a 300mm facility with ST Microelectronics in Agrate, Italy, as well as a 300mm capacity corridor in Intel’s New Mexico factory.
Through its global manufacturing facilities, the Company provides high quality and flexible manufacturing capabilities serving fabless companies and IDMs looking to increase production capacity and diversify locations.
History Overview
Tower Semiconductor was founded in 1993, with the acquisition of National Semiconductor’s 150mm wafer fabrication facility in Migdal Haemek, Israel. Tower became a public company in 1994. In 2001, Fab 2, a 200mm facility, was constructed alongside Fab 1.
In 2008, Tower acquired Jazz Semiconductor’s 200mm facility (Fab 3) which increased global capacity, offered a more comprehensive technology portfolio, a larger customer base, and a stronger financial base.
In 2014, Tower Semiconductor completed a joint venture with Panasonic Corporation enabling Tower Semiconductor to offer its customers state of the art 300mm technology including best of class 65nm CMOS image sensor dark current and quantum efficiency performance and additional 45nm digital technology, adding available capacity of approximately 800,000 wafers per year (8 inch equivalent) in three manufacturing facilities in Japan.
In 2016, in order to support the Company’s strong customer demand and to enable additional manufacturing flexibility, Tower Semiconductor acquired Maxim Integrated’s 8-inch wafer fabrication facility in San Antonio, Texas, United States, cost-effectively increasing production by approximately 28,000 wafers per month.
Workforce
Tower Semiconductor employees approximately 5,000 employees worldwide.