Tower Semiconductor and Juniper Networks Announce World’s First Open Market Silicon Photonics Platform with Monolithically Integrated III-V Lasers
Enables next-generation optical communications for telecoms and datacenters, as well as emerging applications in artificial intelligence and LiDAR for autonomous vehicles
The new platform co-integrates III-V lasers, semiconductor optical amplifiers (SOA), electro-absorption modulators (EAM) and photodetectors with silicon photonics devices, all monolithically on a single chip. This enables smaller, higher-channel count and more power-efficient optical architectures and solutions. Foundry availability will enable a broad array of product developers to create highly integrated photonic integrated circuits (PICs) for diverse markets.
Process design kits (PDK) are expected to be available by year end and the first open multi-project wafer (MPW) run are expected to be offered early next year. First samples of full 400Gb/s and 800Gb/s PICs reference designs with integrated laser are expected to be available in the second quarter of 2022.
“Our mutual development work with Tower has been extraordinarily successful in qualifying this innovative silicon photonics technology in a high-volume manufacturing facility,” said
“Our partnership with Juniper on silicon photonics is bringing a paradigm shift for product development across our industry,” said
For additional details on the PDK and MPW shuttle schedule, please visit here.
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Source: Tower Semiconductor